Three Dimensional (3D) Devices is a term applied to semiconductor chip stacking. Various industry terms such as flip chip and die attach may be also associated with chip stacking but not exclusively so. Hydridization is used as a term which describes the chip stacking process. As discussed on ARC’s webpage SiC Vacuum Chucks, the FC-150 and now the larger and more accurate FC-300 are the tools of choice for bonding two or more die together, especially for low volume (up to 10,000 per year), high precision projects. 3D Chip Stacking has become ubiquitous as companies try to make thinner devices such as cell phones, memory stacks and as stated on the above ARC webpage, Infrared Focal Plane Arrays (IR-FPAs) and their Read-Out Integrated Circuits (ROICs) for Infrared Cameras. Other areas of interest for ARC’s customers are that of hybridizing High-Power Laser Diodes and VCELS with Micro Channel Coolers as shown below. Presented below are additional details about the FC-150 Hybridizer, Bumping Metals, the Hybridization Process, and Laser Die bonding to Micro Channel Coolers.
ARC works with either as-diced die (bare die) or wafers. For wafers, the company has expertise in precision dicing of standard and compound semiconductor wafers.