SiC Vacuum Chucks for Chip-to-Chip 3D Device Hybridization
Infra Red Focal Plane Arrays (IR FPAs) are often ITAR related devices and the manufacturing tooling often comes under ITAR rules.
ARC elminates the ITAR hassle of off-shore SiC and related tooling manufacturing.
Also notable is that ARC delivers its tooling very quickly and easily beats the EU source lead times.
ARC is the only company in the USA that not only performs chip hybridization as a service but also manufactures the SiC tooling 100% in-house as well.
If you are making high end FPA devices and want custom tooling with fast lead times and with no ITAR issues, ARC is your partner of choice.
Laser to Heat Sink, Avalanche Photo-Diodes, MEMs, and many other chip stacking operations are best done on chip stacking systems such as the Suss and SET FC Euipment