SiC Vacuum Chucks for Chip-to-Chip 3D Device Hybridization
Infrared Focal Plane Arrays (IR FPAs) and their Read Out Integrated Circuits (ROICs) are often ITAR controlled devices and the SiC manufacturing tooling often comes under ITAR rules. These rules make it cumbersome to obtain the SiC Chucks from non-US sources.
ARC eliminates the ITAR hassle of non-US sourcing SiC chuck procurement and related tooling manufacturing. In addition, ARC delivery times easily beat OUS sources.
ARC SiC Vacuum chucks for the FC150 are flat and parallel to less than 0.5 um over the 50mm x 50mm surfaces.
If your project requires FPA/ROIC bonded devices and want custom tooling with short lead times and no ITAR issues, and/or your project requires a hybridization service who is also ITAR Registered, ARC is your partner of choice.
Chip to Chip die bonding (Hybridization) applies also to such assemblies as:
Laser to Heat Sink, Avalance Photo-Diodes, MEMs, and other chip stacking operations which are best done on chip stacking systems such as the Suss and SET FC Equipment
ARC can design the SiC Vacuum chucks, bond the die, and test the assembly.