Micro-Nano Fab, MEMs, Thin Films, Back End

Wafer Fab Services

Front-End (FEOL) Capabilities include thin film deposition, photo-lithography, dry and wet etch at wafer level.

Back-End (BEOL) Capabilities include wafer thinning & dicing, bare die and packaging.

Advanced Packaging Capabilities include 3D Chip staking and hybridization with both low and high force solutions.

Backside Metallization, Patterning, Annealing

Class 100 Ballroom
Class 100 Ballroom
Sputtering
4 x 8 inch Targets
Sputtering 4 x 8 inch Targets
Suss MA/BA 6
Suss MA/BA 6
Photo-Lab
Photo-Lab
Wafer Back End
Wafer Back End
Clean Room Assembly
Clean Room Assembly
FC 150 100 kG 
Device Bonder
FC 150 100 kG Device Bonder
Periodic Chart of Elements and Alloys
Periodic Chart of Elements and Alloys
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