Micro-Nano Fab, MEMs, Thin Films, Back End
Wafer Fab Services
Front-End (FEOL) Capabilities include thin film deposition, photo-lithography, dry and wet etch at wafer level.
Back-End (BEOL) Capabilities include wafer thinning & dicing, bare die and packaging.
Advanced Packaging Capabilities include 3D Chip staking and hybridization with both low and high force solutions.
Backside Metallization, Patterning, Annealing