Micro-Nano Fab

MEMs, Thin Films, Back End (more)

Front-End (FEOL) Capabilities include thin film deposition, photo-lithography, dry and wet etch at wafer level (more)

Back-End (BEOL) Capabilities include wafer thinning & dicing, bare die and packaging (more)

Advanced Packaging Capabilities include 3D Chip stacking and hybridization with both low and high force solutions (more)

Backside Metallization, Patterning, Annealing (more)

Class 100 Ballroom
Sputtering 4 x 8 inch Targets
Suss MA/BA 6
Wafer Back End
Clean Room Assembly
FC 150 100 kG Device Bonder
Periodic Chart of Elements and Alloys