Wafer Back End Services – Back Side Metal, Thinning, Dicing, Pick Out, Package

Back-End (BEOL) Capabilities include wafer thinning & dicing, bare die, wire bonding, package and test.

Backside Metallization, Patterning, Annealing

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Wafer Back End
Wafer 18, side 2-AfterMill&PRon-20X-1
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