Thin Films

Metals, Dielectrics, Semiconductors

Front & Back Patterning

Sputtering, Evaporation, CVD, ALD

Back Side Gold
Back Side Gold
Gold on Lift Off Mask
Gold on Lift Off Mask
AMR Sensor
AMR Sensor
Stress Sensor
Stress Sensor

Indium Bumping

High Density ROIC and Detector Wafers

200 mm CMOS Wafers can be processed at 1/4 wafers (ARC Tooling Advantage)

5 x 12 Bumps
High Density
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