FC150 Silicon Vacuum Chucks

Chip-to-Chip 3D Device Hybridization Tools

Hybridization or chip-stacking is a popular technology when numerous connections need to made between two semiconductor chips such as an Infrared Focal Plane Arrays (IrFPA) and its Read-Out Integrated Circuits (ROIC).  As an example a 640 x 512 Focal Plane Array would have 328,000 photo diode pads that must be connected to corresponding pads on the ROIC. One industry standard tool for accomplishing this bonding with excellent positional accuracy (±1um), calibrated thermal and pressure is the FC150 shown below in Figure 1.

Essential components to the FC150 Hybridization process are the availability of hard ceramic (SiC), flat and co-parallel Vacuum Chucks. These chucks have unique vacuum holes and vacuum channel designs machined into their working surfaces corresponding to the Substrate and Chip hold-down requirements. The FC150 requires these Chucks to hold down the “Substrate” onto the Vacuum Stage and the “Chip” up to the Bond Arm. Since the FC150 has two vacuum networks, one network for holding the Chucks in place and the other network to pick-up and firmly hold the Substrate and Chip, it is imperative that the Chucks be as near flat and parallel as possible. ARC 50mm x 50mm Chucks are held to less than 0.5um flat and parallel.

ITAR

US International Traffic in Arms Regulations (ITAR) control certain chip-to-chip assemblies such as IR FPAs and their ROICs, these regulations may also control the FC150 Vacuum Chucks described below in Figures 4 – 8,   ARC is registered with the Department of State allowing the company to handle ITAR related projects.  These Regulations often make it cumbersome to send ITAR marked drawings out of the US and receive the vacuum chucks from non-US sources.

ARC is compliant with ITAR rules and thus eliminates the hassle of non-US sourcing of ITAR controlled SiC vacuum chuck, related tooling and hybridization services. In addition, ARC delivery times are much shorter than non-US sources. If your project requires FPA/ROIC bonded devices and want custom tooling with short lead times and no ITAR issues, and/or your project requires a hybridization service provider who is also ITAR Registered, ARC is your partner of choice.

The FC150 Hybridizer & Hybridization Services

Chip to Chip bonding (Hybridization) applies also to such assemblies as: Laser Chip-to- Heat Sink, Avalanche Photo-Diodes, MEMs, and other chip stacking operations.

Shown on the right in Figures 1 & 2 are the FC150 and an operator in the process of completing a hybridization operation in the ARC cleanroom. ARC has two FC150 tools and offers hybridization services as well as design and manufacturing of the SiC vacuum chucks. Once the Substrate and Chip are bonded, they are removed from the cleanroom and inspected and tested in the ARC Assembly area. ARC is a static controlled facility.

Fiigure 1 FC 150 Hybridizer
Fiigure 1 FC 150 Hybridizer
Figure 2 Hybridization in Process in the ARC Class 200 Clean Room
Figure 2 Hybridization in Process in the ARC Class 200 Clean Room

SiC Vacuum Chucks

ARC FC150 SiC Vacuum chucks are fabricated from high density silicon carbide, ground and polished flat and parallel to less than 0.5 um over the 50mm x 50mm surfaces. A Substrate Chuck is shown mounted on the FC150 Stage in Figure 3 on the near right. A typical Substrate Chuck vacuum pattern is shown in the far right in Figure 4.

Shown below are various non-ITAR SiC Vacuum Chucks.  If a customer needs assistance in designing the proper vacuum channels, an ARC engineer can provide that assistance and is only a phone call or email away.

Drawings and sketches may be submitted through our contact page.  You will be contacted shortly to discuss your project.

Figure 3 A typical SiC Substrate Vacuum Chuck on the FC150 Stage
Figure 3 A typical SiC Substrate Vacuum Chuck on the FC150 Stage
Figure 4 A typical vacuum trace pattern on a Substrate Chuck
Figure 4 A typical vacuum trace pattern on a Substrate Chuck
Figure 5 Custom Substrate Chuck
Figure 5 Custom Substrate Chuck
Figure 6 Custom Pedestal Chip Chuck
Figure 6 Custom Pedestal Chip Chuck
Figure 6 Custom Pedestal Chip Chuck with unique detail, see Figure 8
Figure 6 Custom Pedestal Chip Chuck with unique detail, see Figure 8
Figure 8 Custom Chip Pedestal detail
Figure 8 Custom Chip Pedestal detail
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