Micro-Nano Fab

The ARC Micro-Nano Fab is comprised of the following functions and services which are accessible either as a standalone service or as a component of a larger project.  This Fab when coupled with the other ARC Services offer customers a wide variety of options which are often needed for prototyping through production activities in one facility. The Micro-Nano Fab works seamlessly with the Ultra Machining Fab, the Analytical Lab and the Science and Engineering team to meet project technical and planning objectives.

Drawings and sketches may be submitted via our contact page. You will be contacted shortly to discuss your project.

Member – University of Minnesota Nano Fabrication Center

Wafer Processes
Front End of Line (FEOL)
Processes

Thin Film Deposition

Process Development
• Sputtering, Evaporation CVD, ALD, Plating
Photo-Lithography
• Mask Design, GDS2 Format
• Suss Front-Side Back-Side Mask Aligner
• Canon Stepper
• Heidelberg Direct Write

Figure 1. Class 200 Ballroom Cleanroom
Figure 1. Class 200 Ballroom Cleanroom

Wafer to Package
Back End of Line (BEOL)
Processes

3D Devices

Wafer Scale Fabrication
• NEMS & MEMS Sensors
Advanced Packaging
• Chip Stacking, Flip Chip Hybridization
• 2.5D, 3D Devices
Laser Die Attach to Heat Sink Photonic and Opto-Electronic Devices

FC150 Hybridizer
Figure 2. FC150 Hybridizer

Etching
• Ion Milling,
• Reactive Ion Etch, DRIE
• Wet Etch
Backside Metallization
Annealing, Hydrogen
Passivation Films
• Boron Hydride
• Parylene

Sputtering 4 x 8 inch Targets
Figure 3. Sputtering 4 x 8 inch Targets

MEMS Devices

Design and Manufacturing of Chip Scale Devices

See also:
Wafer Processes
Front End of Line (FEOL) Processes (left)
Wafer Back End, (BEOL)

Clean Room Assembly
Figure 4. Clean Room Assembly

ARC has qualified targets in inventory with regularly used targets such as Au, Ti and Cr preloaded in a sputter tool.

60 Sputtering Target Materials & Alloys
Figure 5. 60 Sputtering Target Materials & Alloys

Wafer to Bare Die
Back End of Line (BEOL)
Processes

Wafer Thinning
Wafer Dicing
Bare Die, Pick out to Tape
Bare Die, Pick out to Tray

Bare Die Pick out to Tape
Figure 6. Bare Die, Pick out to Tape Shown. Pick out to Tray also available
arc-logo2