Thin Film Deposition
ARC deposits thin films by Sputtering, Evaporation, Chemical Vapor Deposition (CVD), and Atomic Layer Deposition (ALD). Each of these methods offer a project designer a variety of process design options.
ARC has over 60 Sputtering targets in house as listed in the Target Chart below. These targets fall into four categories: Elementals, Dielectrics/Glasses, Magnetic Alloys and Other Alloys. Custom Sputtering target compositions of any of these categories are available through ARC’s qualified suppliers.
ARC has 9 Sputtering tools in the Micro-Nano Fab, several are multiple target tools and several are load lock tools.
Evaporation Deposition is used for Indium which is the deposition solder of choice for Hybridization customers when bonding two dissimilar substrates such as in a Focal Plane Arrays (compound Semiconductor) – Read Out IC’s (Silicon) process. Evaporation deposition provides thick films needed for the Bumping process.