Wafer Back End
Wafer Back End of Line (BEOL) best describes those fabrication processes which take place after a semiconductor wafer has been processed and is ready for the additional processing usually beyond the environment of the ultra-clean cleanroom. Wafer types include CMOS, Compound Semiconductor and MEMS device wafers to name a few. ARC is a natural and competent partner for those customers who need these services since ARC fabricates its own MEMS devices, has years of experience processing thin film devices and has developed skills in moving wafers between precision machining and its micro-nano fab.
ARC processes wafers up to 8” in diameter and has also developed a process for handling diced quarter sections of 8” wafers. During the prototype phase and up to early limited production this is a preferred wafer handling typography due to the number of die needed for a project where a wafer fab had more than one project on a wafer to cut cost.
Customers may elect to avail themselves of any of the services below that fit their project needs.