ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
A new wafer chuck material is Materion’s SupremEx (AlSiC). This material is a very strong and lightweight alloy of Aluminum and Silicon Carbide. ARC is currently processing parts using this novel material. For more information on SupremEX visit: http://www.materion.com
Porous Ceramic is another interesting class of materials. These materials are ideal for vacuum wafer chuck applications. They are available in various pore sizes which can be tailored to meet a customer’s vacuum requirements. Following machining, porous chuck are cleaned in a class 200 clean room prior to a quality review and shipment.