3D Chip Stacks

3D Chip Stacking, Hybridization, Indium Bumping

  • SiC Chuck on FC-150

3D Chip Stacking, Hybridization, Indium Bumping

3D Chip Stacks are vertical laminations of one chip upon another chip with electrical connectivity. Often referred to as hybridization, pioneered for Infra-Red Focal Plane Arrays (IR FPAs), this allows for a read-out IC (ROIC), typically CMOS, to be bonded to a compound semiconductor 2-D detector or emitter array.

Arcnano specializes in IR FPAs, high power laser diodes, avalanche photo diodes or Si chip-on-chip. We perform backend processing including contact metallization, indium bumping, die singulation, hybridization and packaging.

Arcnano makes its own SiC vacuum chucks, in-house, and also for much of the industry.


Contact Arcnano

Advanced Research

4459 White Bear Pkwy
White Bear Lake, MN 55110
(651) 789-9000