Arcnano manufacturers SiC Vacuum Chucks for Infra Red Focal Plane Array hybridization process where the ROIC chip is bonding to the detector chip.
Most of these chucks are for FC-150 and FC-300 device hybridization tools made by SET in France, formerly a division of Suss Microtec.
We supply chucks with sub micron flatness and parallelism. We use a Tropel Flatmaster for measurement of flatness and a Zygo NexView for measurement of surface roughness.