Contact, Directions, Travel - ARC Nano ARC Nano

Science and Engineering
Physics Modeling, CAD Design, Finite Element Analysis, SBIR Partnering, STTR Partnering, Government Contracting, Sub-Contracting for Mil/Aero Primes

Wafer Fab Products and Services
Wafer Scale Fabrication: MEMs, Sensors, Devices
Thin Film Deposition: Sputtering, Evaporation, CVD, ALD, Plating
Patterning: Mask Design, GDS2 Format, Suss Front Side Back Side Mask Aligner, Canon Stepper, Heidelberg Direct Write
Etching: Wet Etch, Ion Milling, RIE, DRIE, Ion Milling
Wafer to Package Back End: BEOL, Chip Stacking; 2.5D, 3D Devices, Flip Chip, Laser Die Attach to Heat Sink, Photonic and Opto-Electronic Devices
Wafer Back End Bare Die: Wafer Thinning, Dicing, Pick Out to Tape or Chip Tray

Ultra High Precision Machining Services
CNC 3 Axis and 5 Axis Milling, Wire EDM, Micro EDM, Grinding, Lapping, CMP
Typical materials include Hard Steels, Ceramics, Titanium, Molybdenum, Tungsten, Tantalum, and More

Analytical Services
SEM, EDS, XRF, FIB, AFM, MFM, TEM

Sales	sales at arcnano com
FIB Aperture Strips	www.arcapertures.com